Alchip Technologies Opens 5nm ASIC Design Capabilities

First Dedicated ASIC company to accept 5nm projects


Milpitas, CA. August 13, 2020 – Alchip Technologies to became the first dedicated ASIC company to announce 5nm commercial design readiness and that is accepting 5nm design. First test-chip tape-outs are expected in December.

Alchip’s complete 5nm design-to-delivery methodology focuses on minimizing design turnaround time. Physical design attributes include a chiplet technology platform, high performance computing IP portfolio, IP sub-system integration services and the latest 2.5D heterogeneous packaging capabilities.

The company expects that 5nm demand will come initially from high-performance cloud computing applications. Still, Alchip expects that 5nm devices will be 52% smaller, 3% faster, yet use only 36% of the power, compared to current 7nm devices.

Alchip 5nm designs will draw upon a high-performance computing IP portfolio that includes “best in class” DDR5, GDDR6, HBM2E, HBM3, D2D, PCIe5, 112G serdes IP from Tier 1 providers. Alchip in-house IP sub-system integration services cover PCIe5, DDR5, HBM2E/3, and 112G PAM4 serdes.

Critical to 5nm production is an innovative advanced packaging capability that is for MCM, CoWoS and InFO_os. Package design covers SIPI/thermal simulation that provides plug-and-play post silicon solutions to reduce substrate layers and the resulting cost. The result is very elegant 5nm devices with more accurate power and thermal estimation flows for high power designs that have avoided post-silicon surprises.

“We’re rolling out our 5nm capabilities now to meet hyper-scalers’ demand that is being driven by the work-from-home, online-everything and business continuity surge trends that are driving significant data traffic and demand-pull for compute workloads,” said Johnny Shen, Alchip President and CEO. “We’ve made a commitment to the market that we would meet the demands of advanced technology head-on and today’s 5nm announcement substantiates that commitment.”

Alchip’s 5nm capabilities will have packaging options that include CoWoS and Info_os (seen here) as part of its feature set.

ALCHIP TECHNOLOGIES 7NM ASIC CAPABILITIES SET ADVANCED TECHNOLOGY PACE

Multiple tape outs solidify industry lead

Milpitas, CA. July 21, 2020 – With the number of expected tape outs jumping to nine by the end of 2020 Alchip Technologies, Limited has become one of the leading advanced technology ASIC providers. Alchip revealed that it had completed 3 tape outs in May alone.

Alchip’s 7nm ASIC capabilities focus on full reticle size devices that features billions of gate count for ultra-large-scale design. These advanced ICs primarily target artificial intelligence, high-performance computing, network and storage applications.

Key to the company’s success is a proven design flow and methodology that optimizes the designs architecture for power, performance and area requirements while meeting stringent tape out schedules.

Alchip’s full 7nm capabilities include large scale design partition and signoff, an abutment flow that includes design-for-test, and a complete 2.5D package design flow that covers interposer/substrate design with comprehensive system co-design signoff.

The innovate packaging service covers SIPI/thermal simulation that provides plug-and-play post silicon solutions to reduce substrate layers and the resulting cost. The result is very elegant 7nm devices with more accurate power and thermal estimation flows for high power designs that have avoided post-silicon surprises.

Beside it’s 7nm success, Alchip also revealed that it’s currently working on a 6nm project, with several more in the pipeline.

“Alchip’s sweet spot has always been in leading edge technologies and at 7nm, we have recorded 100% silicon success with our repeat customers,” said Johnny Shen, Alchip President and CEO. “Our proven design and sign-off methodology is enhanced by the strong service mindset of our corporate culture.”

Alchip’s 7nm ASIC capabilities are in demand for devices powering target artificial intelligence, high-performance computing, network and storage applications.

ALCHIP TECHNOLOGIES 7NM ASIC CAPABILITIES SET ADVANCED TECHNOLOGY PACE

Multiple tape outs solidify industry lead

Milpitas, CA. July 21, 2020 – With the number of expected tape outs jumping to nine by the end of 2020 Alchip Technologies, Limited has become one of the leading advanced technology ASIC providers. Alchip revealed that it had completed 3 tape outs in May alone.

Alchip’s 7nm ASIC capabilities focus on full reticle size devices that features billions of gate count for ultra-large-scale design. These advanced ICs primarily target artificial intelligence, high-performance computing, network and storage applications.

Key to the company’s success is a proven design flow and methodology that optimizes the designs architecture for power, performance and area requirements while meeting stringent tape out schedules.

Alchip’s full 7nm capabilities include large scale design partition and signoff, an abutment flow that includes design-for-test, and a complete 2.5D package design flow that covers interposer/substrate design with comprehensive system co-design signoff.

The innovate packaging service covers SIPI/thermal simulation that provides plug-and-play post silicon solutions to reduce substrate layers and the resulting cost. The result is very elegant 7nm devices with more accurate power and thermal estimation flows for high power designs that have avoided post-silicon surprises.

Beside it’s 7nm success, Alchip also revealed that it’s currently working on a 6nm project, with several more in the pipeline.

“Alchip’s sweet spot has always been in leading edge technologies and at 7nm, we have recorded 100% silicon success with our repeat customers,” said Johnny Shen, Alchip President and CEO. “Our proven design and sign-off methodology is enhanced by the strong service mindset of our corporate culture.”

Alchip’s 7nm ASIC capabilities are in demand for devices powering target artificial intelligence, high-performance computing, network and storage applications.