Alchip Technologies Joins UCIe Consortium

Will Help Define the Future of High Performance Chiplet Technology

Taipei, Taiwan October 25, 2022–Alchip Technologies has joined the UCIe™ (Universal Chiplet Interconnect Express™) Consortium at the contributor level, reinforcing its position as the high-performance ASIC leader.

UCIe provides the ability to package dies from different sources, including different fabs, different designs, and different packaging technologies. It is an open industry standard interconnect offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between chiplets.

As a contributor, Alchip will actively influence the direction of chiplet technology through its participation in technical working groups.

UCIe, as an advanced technology alliance, is important for Alchip and its high-performance computing ASIC customers because it addresses the growing demands of compute, memory, storage, and connectivity across the entire compute continuum spanning cloud, edge, enterprise, 5G, automotive, high-performance computing, and hand-held segments.

“It is imperative that Alchip becomes an active participant in the UCIe, given the initiatives’ importance to the future of advanced technology ASICs. By joining, Alchip assumes its rightful leadership role as an active contributor into technology standards that will guide the semiconductor industry’s future,” explains Johnny Shen, Alchip President and CEO.

Universal Chiplet Interconnect Express™ and UCIe™ are trademarks of the UCIe™ Consortium.